Technical Program Committee

Lorenzo Mucchi
University of Florence, Dept. of Information Engineering, Italy

Ahmed Khorshid
University of California, Irvine, USA

Attaphongse Taparugssanagorn
National Electronics and Computer Technology Center, Thailand

Chika Sugimoto
Yokohama National University, Japan

Claire Goursaud
CITI INRIA, France

Eryk Dutkiewicz
University of Technology Sydney, Australia

Giancarlo Fortino
University of Calabria, Italy

Hamed Farhadi
Ericsson Research, Sweden

Heikki Karvonen
University in Oulu, Finland

Hirokazu Tanaka
Hiroshima City University, Japan

Huan-Bang Li
National Institute of Information and Communications Technology, Japan

Ilangko Balasingham
Oslo University Hospital & NTNU, Norway

John Farserotu
The Swiss Center for Electronics and Microtechnology CSEM, Switzerland

Kamran Sayrafian
National Institute of Standards and Technology, USA

Kamya  Yekeh Yazdandoost
Aalto University, Finland

Kimmo Kansanen
Norwegian University of Science and Technology NTNU, Norway

Ladislau Matekovits
Polytechnic of Turin, Italy

Lin Wang
Xiamen University, China

Luca De Nardis
Sapienza University of Rome, Italy

Marc Girod-Genet
 Institut Polytechnique de Paris, France

Marcos Katz
University of Oulu, Finland

Mariella Särestöniemi
University of Oulu, Finland

Mehmet Yuce
Electrical and Computer Systems Engineering, Monash University, Australia

Minseok Kim
Niigata University, Japan

Mohammad Ghavami
London South Bank University, UK

Qiong Wang
Dresden University of Technology, Germany

Raffaele D’Errico
CEA-LETI Minatec Campus, France

Gravina Raffaele
University of Calabria, Italy

Sen Qiu
Dalian University of Technology, China

Shinsuke Hara
Osaka City University, Japan

Takahiro Aoyagi
Tokyo Institute of Technology, Japan

Timo Kumpuniemi
University of Oulu, Finland

Tuomas Paso
Centre for Wireless Communications, University of Oulu, Finland

Ville Niemelä
Centre for Wireless Communications, University of Oulu, Finland

Xinrong Li
University of North Texas, USA

Ildiko Peter
National Interuniversity Consortium of Materials Science and Technology INSTM, Polytechnic of Turin, Italy

Valeria  Loscri
The Inria Lille-Nord Europe Centre, France

Ilkka Laakso
Aalto University, Finland

Girish Revadigar
Singapore University of Technology and Design, Singapore

Chitra Javali
National Cybersecurity R&D Lab, National University of Singapore, Singapore

Rizwan Ahmad
National University of Sciences and Technology, Pakistan

Waqas Ahmed
Pakistan Institute of Engineering and Applied Sciences, Pakistan

Alar Kuusik
Tallinn University, Estonia

Yannick Le Moullec
Tallinn University, Estonia

Andrei Krivosei
Tallinn University of Technology, Estonia

Qammer Abbassi
University of Glasgow, Scotland

Rida Khan
Tallinn University of Technology, Estonia

Abdul Saboor
Tallinn University of Technology, Estonia

Tauseef Ahmed
Tallinn University of Technology, Estonia

Triin Kask
Tallinn University of Technology, Estonia

Imran Khan Niazi
New Zealand College of Chiropractic, New Zealand

Muhammad Alam
Tallinn University of Technology, Estonia